π2-Cygni

Modular Sub-Micron Patterning and Photolithographic System
Never before has there been a tool which combines high power, exceptional uniformity, and versatility in an efficient and compact modular form fact - at 172 nm! The revolution begins with the introduction of the π2-Cygni series of vacuum-ultraviolet light processing systems.
images

All-In-One Construction

Efficient light source, passive cooling, and integrated purge system means that everything needed for operation is contained in the system itself. Just plug in the included 12 Vac power adapter, connect to a purge-gas source with the 1/4" quick-connect fitting, and the π2-Cygni is ready for use.

A Complete and Flexible VUV Exposure System

Using a modular design approach, the π2-Cygni provides capability "right-out-of-the-box" for:

  • General purpose large-area VUV flood exposures with integrated inert gas purging
  • Basic photoprocess with included exposure chamber and mask holder
  • High-resoluton photolithography with included hard-contact photo-mask processing module
  • Integration with existing systems using the standardized mounting system
Card image cap

    Applications

  • High-Resolution Photolithography
  • Photoablation
  • Photolytic/Photocatalytic Processes
  • Surface Energy Modification
  • Ozone Generation
  • Low-Damage Atomic-Level Surface Cleaning
  • Enhanced Thin Film Adhesion

    Features

  • Next-Generation VUV Light Source: 172 nm
  • Best-In-Class Output Intensity
  • Exceptional Beam Uniformity: 3% Across Available Aperture
  • Long Lamp Life: Up to 30,000 Exposures
  • Near-Instantaneous Lamp Turn-On
  • Compact, Rugged, and Portable
  • Standardized Accessory Mounting Sytem: One Light Source, Many Applications
  • Intuitive Design Reduces Training Requirements for All Users
  • Environmentally Friendly Operation and Processing

VUV. A New Processing Regime

The low output power of traditional 172 nm sources has prevented the widespread use and application of this wavelength, both in research and production environments. The π2-Cygni overcomes this barrier and is revealing the true power of 172 nm - driving new chemistries, reaction regimes, and processing techniques. Ultraviolet is not just for photolithography and curing anymore!

A New Way to Think of Power

UV arc lamps provide high average power. Excimer UV sources provide high photon flux. The π2-Cygni provides both high average power and high photon flux - without the need for active or external cooling. This unique combination of high power and high photon flux is harnessed in a package that fits in the palm of your hand, yet drives large-area reactions and processes not achievable by other light sources

A New Form Factor in Lamp Technology

The heart of each π2-Cygni is a planar microcavity discharge lamp. Broad-area emission provides superior uniformity compared to traditional arc-discharge lamps, while simultaneously eliminating the need for complex condensing, collimating, and homogenizing optics

Ultraviolet is Now Green

Prior to the π2-Cygni, ultraviolet light production typically meant toxic materials, low conversion efficiency, and high equipment cost. π2-Cygni smashes these barriers by providing a solution which is environmentally friendly and energy efficient. No toxic materials are utilized in the manufacture and construction of π2-Cygni, and the utilization of π2-Cygni in production processes provides potential for reducing chemical waste streams and water consumption. All at a fraction of the cost of other 172 nm sources.

Sample/Substrate
  Maximum size:
  Minimum size:
  Maximum mask+sample thickness:

50 mm × 50 mm (2” × 2”)
10 mm × 10 mm (0.4” × 0.4”)
8 mm
Mask size 75 mm × 75 mm (3” × 3”)
custom size (optional)
Sample Alignment
  Travel Range
        X,Y:
        Theta:
  Resolution
        X,Y:
        Theta:


± 6 mm
± 10° (coarse), ± 3° (Fine)

< 1.5 μm (< 0.5 μm optional)
2 × 10-4 °
Power requirements
  Voltage:

  Power consumption:

12 VDC, 110/220 V AC
(12 VDC adapter included)
< 20 W
Utilities
  Vacuum (optional):
  Compressed air (optional):

< -0.2 bar
> 1.1 bar
Exposure mode: Soft contact, hard contact
Physical dimensions
  Width:
  Depth:
  Height:

  205 mm (8”)
  230 mm (9”)
  400 mm (15.5”)
Weight: < 12 kg (26.5 lb)
Exposure Wavelengths
(requires π-Photon, sold separately):
172 nm, 222 nm, 308 nm

* Dry nitrogen or Ar purging is required for operation

** UV-grade fused silica transmission spectrum must be verified by manufacturer